PhD position in multi-material additive manufacturing for advanced chip cooling

Job description

We offer a fully funded 4-year PhD position within the University of Twente on the development of ultra-efficient cooling technologies for advanced semiconductor packaging. The project, UltraCool, combines materials science, additive manufacturing, thermal engineering, and semiconductor integration to enable direct bonding between silicon and high-conductivity metals such as copper.
The rapid growth of AI and high-performance computing is driving heat fluxes in advanced chip packages beyond 1,000 W/cm², making thermal management one of the key bottlenecks for future electronics. This PhD project aims to address this challenge through the design of novel interlayer alloys, development of multi-material Laser Powder Bed Fusion (LPBF) processes, and integration of cooling functionality directly into package-level demonstrators.
The research will focus on the thermodynamic design of interlayer alloy feedstocks, powder production and characterization, multi-material LPBF process optimization, and the investigation of interfacial physics governing residual stress, defect formation, and thermal transport across copper–silicon interfaces. You will work with characterization methods including SEM, EBSD, XRD, thermal conductivity analysis, and thermo-mechanical testing. The project also includes the fabrication and validation of package-level cooling demonstrators for direct and indirect chip cooling applications.
You will work in a highly interdisciplinary and international environment together with academic researchers and industrial partners active in semiconductor packaging, powder production, sensing technologies, and thermal management. The project offers excellent opportunities to contribute to high-impact scientific research while developing technologies with strong industrial relevance.

Requirements

We are looking for a highly motivated, enthusiastic, and self-driven researcher who meets the following qualifications:

• A Master’s degree in Mechanical Engineering or Materials Science and Engineering or another relevant engineering/science discipline.
• Strong interest in additive manufacturing, materials development, thermal management, and semiconductor packaging.
• Experience with materials characterization techniques such as SEM, EBSD, XRD, thermal characterization methods, and mechanical testing is highly desirable.
• Familiarity with additive manufacturing processes, particularly Laser Powder Bed Fusion, is an advantage.
• Knowledge of metallurgy or computational materials engineering is beneficial.
• Ability to work independently and collaboratively within an interdisciplinary research environment.
• Strong analytical, experimental, and problem-solving skills.
• Motivation to contribute to both fundamental research and industrially relevant technology development.
• Excellent communication skills and proficiency in English, both spoken and written.

Additional information

Are you interested in being part of our team? Please send your application by November 1, 2026, via the "Apply Now" button and include the following documents:

• A cover letter (maximum one A4 page), emphasizing your motivation, relevant expertise, and interest in the project.
• A detailed CV including academic achievements, research experience, publications (if applicable), and contact information of at least three references.
• Academic transcripts from your Bachelor’s and Master’s studies.

For more information about this position, you are welcome to contact Dr. Davoud Jafari at davoud.jafari@utwente.nl.
The first (online) job interviews will take place on July 10.
Screening is part of the selection procedure.